Rigid board muaj peev xwm | |
Number ntawm txheej: | 1-42 txheej |
Khoom siv: | FR4 \ siab TG FR4 \ Lead dawb khoom \ CEM1 \ CEM3 \ Aluminium \ Hlau core \ PTFE \ Rogers |
Tawm txheej Cu thickness: | 1-6 ZPO |
Sab hauv txheej Cu thickness: | 1-4 ZOS |
Qhov chaw ua haujlwm siab tshaj plaws: | 610 * 1100 hli |
Yam tsawg kawg nkaus board thickness: | 2 txheej 0.3mm (12mil) |
4 txheej 0.4mm (16mil) | |
6 txheej 0.8mm (32mil) | |
8 txheej 1.0mm (40mil) | |
10 txheej 1.1mm (44mil) | |
12 txheej 1.3mm (52mil) | |
14 txheej 1.5mm (59mil) | |
16 txheej 1.6mm (63mil) | |
Yam tsawg kawg nkaus: | 0.076 hli (3mil) |
Qhov chaw tsawg kawg: | 0.076 hli (3mil) |
Qhov tsawg kawg nkaus qhov loj (qhov kawg): | 0.2 hli |
Aspect ratio: | 10:01 ib |
Drilling qhov loj: | 0.2-0.65 hli |
Drilling kam rau ua: | +\-0.05mm (2mil) |
PTH kam rau ua: | Φ0.2-1.6mm +\-0.075mm (3mil) |
Φ1.6-6.3mm + \-0.1mm (4mil) | |
NPTH kam rau ua: | Φ0.2-1.6mm +\-0.05mm (2mil) |
Φ1.6-6.3mm + \-0.05mm (2mil) | |
Finish board kam rau ua: | Thickness: 0.8mm, kam rau ua: +/- 0.08mm |
0.8mm≤Thickness≤6.5mm, kam rau ua +/-10% | |
Yam tsawg kawg nkaus soldermask choj: | 0.076 hli (3mil) |
Twisting thiab dabtsi yog khoov: | ≤0.75% Min 0.5% |
Raneg of TG: | 130-215 ℃ |
Impedance kam rau ua: | +/- 10%, Min +/- 5% |
Kev kho deg: | HASL, LF HASL |
Immersion Kub, Flash Kub, Kub ntiv tes | |
Immersion Silver, Immersion Tin, OSP | |
Xaiv Kub Plating, Kub thickness mus txog 3um (120u ") | |
Carbon Print, Peev Xwm S / M, ENEPIG | |
Aluminium board muaj peev xwm | |
Number ntawm txheej: | Ib txheej, ob txheej |
Maximum board loj: | 1500 * 600 hli |
Board thickness: | 0.5-3.0 hli |
Copper thickness: | 0.5-4 oz |
Yam tsawg kawg nkaus qhov loj: | 0.8mm ib |
Qhov dav tsawg kawg nkaus: | 0.1 hli |
Qhov chaw tsawg kawg: | 0.12 hli |
Yam tsawg kawg nkaus pad loj: | 10 micron |
Nto tiav: | HASL, OSP, ENIG |
Shaping: | CNC, Punching, V-txiav |
Khoom siv: | Universal Tester |
Flying Probe Qhib / Short Tester | |
Lub zog loj Microscope | |
Solderability Test Kit | |
Peel Strength Tester | |
High Volt Qhib & Luv tester | |
Hla Ntu Moulding Khoom Nrog Polisher | |
FPC muaj peev xwm | |
Txheej: | 1-8 txheej |
Board thickness: | 0.05-0.5 hli |
Copper thickness: | 0.5-3 ooj |
Yam tsawg kawg nkaus: | 0.075 hli |
Qhov chaw tsawg kawg: | 0.075 hli |
Hauv qhov loj me: | 0.2 hli |
Yam tsawg kawg nkaus laser qhov loj: | 0.075 hli |
Yam tsawg kawg nkaus punching qhov loj: | 0.5 hli |
Soldermask kam rau ua: | +\-0.5 hli |
Yam tsawg kawg routing dimension kam rau ua: | +\-0.5 hli |
Nto tiav: | HASL, LF HASL, Immersion Silver, Immersion Kub, Flash Kub, OSP |
Shaping: | Punching, Laser, Txiav |
Khoom siv: | Universal Tester |
Flying Probe Qhib / Short Tester | |
Lub zog loj Microscope | |
Solderability Test Kit | |
Peel Strength Tester | |
High Volt Qhib & Luv tester | |
Hla Ntu Moulding Khoom Nrog Polisher | |
Rigid & flex muaj peev xwm | |
Txheej: | 1-28 txheej |
Khoom siv: | FR-4 (High Tg, Halogen Dawb, Ntau zaus) |
PTFE, BT, Getek, Aluminium puag, tooj liab puag, KB, Nanya, Shengyi, ITEQ, ILM, Isola, Nelco, Rogers, Arlon | |
Board thickness: | 6-240mil / 0.15-6.0 hli |
Copper thickness: | 210um (6oz) rau txheej txheej 210um (6oz) rau txheej txheej |
Min mechanical laum loj: | 0.2 hli / 0.08 " |
Aspect ratio: | 2:01 ib |
Max vaj huam sib luag loj: | Sigle sab los yog ob sab: 500mm * 1200mm |
Multilayer txheej: 508mm X 610mm (20 "X 24") | |
Min kab dav / qhov chaw: | 0.076 hli / 0.076 hli (0.003 ″ / 0.003 ″) / 3mil / 3mil |
Ntawm qhov hom: | Qhov muag tsis pom / faus / Plugged (VOP, VIP…) |
HDI / Microvia: | YOG |
Nto tiav: | HASL, LF HASL |
Immersion Kub, Flash Kub, Kub ntiv tes | |
Immersion Silver, Immersion Tin, OSP | |
Xaiv Kub Plating, Kub thickness mus txog 3um (120u ") | |
Carbon Print, Peev Xwm S / M, ENEPIG | |
Shaping: | CNC, Punching, V-txiav |
Khoom siv: | Universal Tester |
Flying Probe Qhib / Short Tester | |
Lub zog loj Microscope | |
Solderability Test Kit | |
Peel Strength Tester | |
High Volt Qhib & Luv tester | |
Hla Ntu Moulding Khoom Nrog Polisher |
Post lub sij hawm: Sep-05-2022