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PCB Fabrication Txheej txheem cej luam

Ntawm ANKE PCB, tus qauv PCB cov kev pabcuam xa mus rau tag nrho cov khoom siv hluav taws xob tsim hluav taws xob tsim khoom.Nrog ntau tshaj 10 xyoo PCB manufacturing kevs, peb tau tuav phav phav PCB tej yaam num npog yuav luag txhua yam khoom siv substrate nrog rau FR4, Aluminium, Rogers thiab ntau dua.Nplooj ntawv no tsuas yog hais txog tus qauv FR4 raws li PCBs.Rau PCBs uas muaj cov txheej txheem tshwj xeeb, thov xa mus rau cov nplooj ntawv web sib txuas rau cov ntaub ntawv los yog xav xa email tuaj rau peb ntawminfo@anke-pcb.com.

Sib txawv nrog pcb sampling, tus qauv PCB muaj nruj dua kev kam rau ua thiab ruaj khov ntau lawm zoo.

Standard PCB cov kev pabcuam raug pom zoo thaum koj tsim tau npaj los hloov los ntawm cov qauv mus rau ntau lawm.Peb tuaj yeem tsim tau txog li 10 lab qhov zoo PCBs hauv 2 hnub xwb.Txhawm rau muab koj qhov project xav tau kev ua haujlwm thiab muaj peev xwm ntau dua, peb muab cov yam ntxwv siab heev rau cov kev pabcuam PCB.Lub peev xwm muaj peev xwm qhia tau raws li hauv qab no:

Txoj Kev Muaj Peev Xwm

Feature

 Muaj peev xwm

Qib Qib

Standard IPC 2

Number of Layers

1 -42 txheej

Order Quantity

1pc - 10,000,000 pcs

Lub sijhawm ua haujlwm

1 hnub - 5 lub lis piam (Kev Pabcuam Ceev)

Khoom siv

FR-4 Standard Tg 150 ° C, FR4-High Tg 170 ° C, FR4-High-Tg180 ° C, FR4-Halogen-dawb, FR4-Halogen-dawb & High-Tg

Board Loj

610 * 1100 hli

Board loj kam rau ua

± 0.1 hli - ± 0.3 hli

Board Thickness

0.2-0.65 hli

Board Thickness kam rau ua

± 0.1 hli - ± 10%

Tooj Luj

1-6 ZPO

Inner Layer Copper Luj

1-4 ZOS

Copper Thickness kam rau ua

+0μm + 20μm

Min Tracing/Spacing

3 mil/3 mil

Solder Mask Sab

Raws li cov ntaub ntawv

Solder Mask Xim

Ntsuab, Dawb, Xiav, Dub, Liab, Daj

Silkscreen Sab

Raws li cov ntaub ntawv

Silkscreen Xim

Dawb, Xiav, Dub, Liab, Daj

Nto tiav

HASL - Kub Cua Solder Leveling

Lead Dawb HASL - RoHS

ENIG - Electroless Nickle / Immersion Kub - RoHS

ENEPIG - Electroless Nickel Electroless Palladium Immersion Kub - RoHS

Immersion Nyiaj - RoHS

Immersion Tin - RoHS

OSP -Organic Solderability Preservatives - RoHS

Xaiv Kub Plating, Kub thickness mus txog 3um (120u)

Min Annular Nplhaib

3mil ua

Min Drilling Qhov Diameter

6mil, 4mil-laser xyaum

Min Dav ntawm Cutout (NPTH)

Min Dav ntawm Cutout (NPTH)

NPTH Qhov Loj Tolerance

± 0.002" (± 0.05 hli)

Min Dav ntawm Qhov Qhov Qhov (PTH)

0.6mm ib

PTH Qhov Loj Tolerance

±.003" (± 0.08mm) - ± 4mil

Nto / Qhov Plating Thickness

20 m - 30 m

SM kam rau ua (LPI)

00.003 "(0.075 hli)

Aspect Ratio

1.10 (qhov loj: board thickness)

Kuaj

10V - 250V, ya sojntsuam lossis kuaj fixture

Impedance kam rau ua

± 5% - ± 10%

SMD Pitch

0.2 hli (8mil)

BGA Pitch

0.2 hli (8mil)

Chamfer ntawm Kub ntiv tes

20, 30, 45, 60

Lwm yam txuj ci

Kub ntiv tes

Qhov muag tsis pom thiab faus qhov

peelable solder daim npog qhov ncauj

Ntug plating

Carbon Mask

Kapton daim kab xev

Countersink / counterbore qhov

Ib nrab txiav / Castellated qhov

Nias lub qhov

Ntawm tented / npog nrog cob

Los ntawm plugged / puv nrog cob

Nyob rau hauv pad

Hluav taws xob kuaj