Ntawm ANKE PCB, tus qauv PCB cov kev pabcuam xa mus rau tag nrho cov khoom siv hluav taws xob tsim hluav taws xob tsim khoom.Nrog ntau tshaj 10 xyoo PCB manufacturing kevs, peb tau tuav phav phav PCB tej yaam num npog yuav luag txhua yam khoom siv substrate nrog rau FR4, Aluminium, Rogers thiab ntau dua.Nplooj ntawv no tsuas yog hais txog tus qauv FR4 raws li PCBs.Rau PCBs uas muaj cov txheej txheem tshwj xeeb, thov xa mus rau cov nplooj ntawv web sib txuas rau cov ntaub ntawv los yog xav xa email tuaj rau peb ntawminfo@anke-pcb.com.
Sib txawv nrog pcb sampling, tus qauv PCB muaj nruj dua kev kam rau ua thiab ruaj khov ntau lawm zoo.
Standard PCB cov kev pabcuam raug pom zoo thaum koj tsim tau npaj los hloov los ntawm cov qauv mus rau ntau lawm.Peb tuaj yeem tsim tau txog li 10 lab qhov zoo PCBs hauv 2 hnub xwb.Txhawm rau muab koj qhov project xav tau kev ua haujlwm thiab muaj peev xwm ntau dua, peb muab cov yam ntxwv siab heev rau cov kev pabcuam PCB.Lub peev xwm muaj peev xwm qhia tau raws li hauv qab no:
Txoj Kev Muaj Peev Xwm
Feature | Muaj peev xwm |
Qib Qib | Standard IPC 2 |
Number of Layers | 1 -42 txheej |
Order Quantity | 1pc - 10,000,000 pcs |
Lub sijhawm ua haujlwm | 1 hnub - 5 lub lis piam (Kev Pabcuam Ceev) |
Khoom siv | FR-4 Standard Tg 150 ° C, FR4-High Tg 170 ° C, FR4-High-Tg180 ° C, FR4-Halogen-dawb, FR4-Halogen-dawb & High-Tg |
Board Loj | 610 * 1100 hli |
Board loj kam rau ua | ± 0.1 hli - ± 0.3 hli |
Board Thickness | 0.2-0.65 hli |
Board Thickness kam rau ua | ± 0.1 hli - ± 10% |
Tooj Luj | 1-6 ZPO |
Inner Layer Copper Luj | 1-4 ZOS |
Copper Thickness kam rau ua | +0μm + 20μm |
Min Tracing/Spacing | 3 mil/3 mil |
Solder Mask Sab | Raws li cov ntaub ntawv |
Solder Mask Xim | Ntsuab, Dawb, Xiav, Dub, Liab, Daj |
Silkscreen Sab | Raws li cov ntaub ntawv |
Silkscreen Xim | Dawb, Xiav, Dub, Liab, Daj |
Nto tiav | HASL - Kub Cua Solder Leveling Lead Dawb HASL - RoHS ENIG - Electroless Nickle / Immersion Kub - RoHS ENEPIG - Electroless Nickel Electroless Palladium Immersion Kub - RoHS Immersion Nyiaj - RoHS Immersion Tin - RoHS OSP -Organic Solderability Preservatives - RoHS Xaiv Kub Plating, Kub thickness mus txog 3um (120u”) |
Min Annular Nplhaib | 3mil ua |
Min Drilling Qhov Diameter | 6mil, 4mil-laser xyaum |
Min Dav ntawm Cutout (NPTH) | Min Dav ntawm Cutout (NPTH) |
NPTH Qhov Loj Tolerance | ± 0.002" (± 0.05 hli) |
Min Dav ntawm Qhov Qhov Qhov (PTH) | 0.6mm ib |
PTH Qhov Loj Tolerance | ±.003" (± 0.08mm) - ± 4mil |
Nto / Qhov Plating Thickness | 20 m - 30 m |
SM kam rau ua (LPI) | 00.003 "(0.075 hli) |
Aspect Ratio | 1.10 (qhov loj: board thickness) |
Kuaj | 10V - 250V, ya sojntsuam lossis kuaj fixture |
Impedance kam rau ua | ± 5% - ± 10% |
SMD Pitch | 0.2 hli (8mil) |
BGA Pitch | 0.2 hli (8mil) |
Chamfer ntawm Kub ntiv tes | 20, 30, 45, 60 |
Lwm yam txuj ci | Kub ntiv tes Qhov muag tsis pom thiab faus qhov peelable solder daim npog qhov ncauj Ntug plating Carbon Mask Kapton daim kab xev Countersink / counterbore qhov Ib nrab txiav / Castellated qhov Nias lub qhov Ntawm tented / npog nrog cob Los ntawm plugged / puv nrog cob Nyob rau hauv pad Hluav taws xob kuaj |